3D Integration Technology and Its Application to Biomedical Integrated Devices
报告人：Prof. Tetsu TANAKA
(Graduate School of Biomedical Engineering Tohoku University, JAPAN)
Semiconductor neural engineering is a discipline that uses semiconductor process/device/circuit technologies to further understand properties of neural systems and to create novel fusion systems of living body and machine. One of the goals in my laboratory is to establish semiconductor neural engineering and develop biomedical mi-cro/nano systems including:
1. Intelligent Si neural probe and brain-machine interface 2. Fully-implantable retinal prosthesis system . 3. Bio/nano technology and novel Bio-FET sensor 4. 3-D integration technology and Analog/Digital LSI design.
In this presentation, I will talk about overviews and current research results of 3D integration technology including reliability evaluation. I will also mention its application to biomedical integrated devices such as fully-implantable retinal prosthesis, intelligent Si neural probe, and bio-FET sensor.
Tetsu Tanaka received the B.S. and M.S. degrees in electronics engineering and the Ph.D. degree in machine intelligence and systems engineering from Tohoku University, Sendai, Japan, in 1987, 1990, and 2003, respectively. In 1990, he joined Fujitsu Laboratories, Ltd. From 1994 to 1995, he was a Visiting Fellow with University of California, Berkeley. In 2005, he moved to the Tohoku University as an Associate Professor, and became a Professor of Graduate School of Biomedical Engineering, Tohoku University in 2008.