Advanced materials and manufacturing to enable heterogeneous integration for multifunctional miniaturised devices
For some decades the world has observed a ultimate impact of development of novel materials and advanced manufacturing processes to enable 3D multi-material heterogeneous multifunctional embodiment, integration and miniaturisation of future generation devices readily applicable and penetrating through telecom, IoTs, energy, security, aerospace/defence, space, transport, healthcare/bio-medical sectors. Evolving initially from silicon-based manufacturing technologies thanks to huge investment and established infrastructure, the current state-of-the-art plays characterised by moving further according to “More than Moore” has substantially reshaped and expanded global capacity, achieving complex microsystem integration through hybrid multi-materials and manufacturing processes, that are confined in ever smaller spaces or dimensions. However, to move forward various bottlenecks remain in terms of key enabling technologies as well as the fundamental insights to underpin a paradigm of multifunctional heterogeneous integration. In particular, with wider range of technology, materials and fabrication processes being available or further developed the challenges yet still exist in elaborating the fundamental aspects of the materials interfacial interactions which will ultimately govern the functionality and reliability of any integrated products. This talk is intended to demonstrate how the fundamental research can assist to meet these challenges based on a number of case studies, including: i) Micro- nano- scale electronics integrations through novel materials depositions, bonding/assembly processes, micro-bump/spheres Pb free bonding, and copper (Cu wire and column) interconnects; ii) Micro- to nano- scale characterisation and testing of microstructural and micro-mechanical behaviour by ex-situ/in-situ analysis, interfacial interactions of interconnects; iii) Electronics for harsh, severe and extreme environments in power/hybrid electronics, space/high energy physics cryogenic electronics; iv) Intelligent, adaptable electronics for healthcare and wellbeing in wearable/attachable/Implantable electronics and printed/flexible/organic electronics; v) 3D electro- bio-materials integration in Lab on Chip (LoB) for in vitro diagnostic (IVD) point of care testing (POCT) and 3D bionic biological printing to mimic tissue constructs.
Changqing Liu received his BEng from Nanjing University of Science and Technology (1985); and his MSc from the Chinese Academy of Science (1988) in China. He was then appointed as an assistant professor for 5 years at Institute of Metals Research of Chinese Academy of Science. From 1993 he secured an Overseas Research Scholarship and moved to UK reading his PhD at Hull University. From 1997 he worked for 3 years as postdoctoral research fellow at Birmingham University in UK after obtaining his PhD degree. From 2000 he joined the Wolfson School of Mechanical, Electrical and Manufacturing Engineering at Loughborough University, where he became Professor of Electronics Manufacture since 2011 following his appointment as Lecturer (2005), Senior Lecturer (2007). His current research focuses on advanced materials and innovative manufacturing to enable 3D multi-material heterogeneous embodiment, integration and miniaturisation of future generation multifunctional devices. He has published over 242 academic papers, and currently a Fellow of Higher Education Academy, UK, and a senior IEEE member and previously served as Chair of the Interconnections Committee of ECTC (USA) and Chair of Packaging Materials & Processes Committee of ICEPT (China).